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NUS6160MN
PACKAGE DIMENSIONS
QFN22, 3x4, 0.5P
CASE 485AT ? 01
ISSUE B
PIN 1
REFERENCE
D
A
B
L1
L
DETAIL A
OPTIONAL
CONSTRUCTIONS
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PADS AS WELL AS THE TERMINALS.
2X
0.15 C
2X
0.15 C
TOP VIEW
E
EXPOSED Cu
MOLD CMPD
A1
DETAIL B
OPTIONAL
CONSTRUCTIONS
A3
DIM
A
A1
A3
b
D
D2
D3
D4
E
E2
MILLIMETERS
MIN NOM MAX
0.80 0.90 1.00
0.00 0.025 0.05
0.20 REF
0.20 0.25 0.30
3.00 BSC
1.45 1.50 1.55
0.52 0.57 0.62
1.02 1.07 1.12
4.00 BSC
1.05 1.10 1.15
0.10 C
25X
0.08 C
NOTE 4
DETAIL B
A3
SIDE VIEW
A1
A
C
SEATING
PLANE
E3
E4
e
K
L
L1
G
G1
G2
1.30 1.35
1.40 1.45
0.50 BSC
0.25 ???
0.30 0.325
??? ???
1.35 1.40
0.95 1.05
0.855 0.885
1.40
1.50
???
0.35
0.15
1.50
1.15
0.915
G
D3
DETAIL A
E3
7
G1
D4
12
E4
22X
L
SOLDERING FOOTPRINT*
3.30
1.55
0.50 0.925
PITCH
PACKAGE
OUTLINE
1
1.47
1.21
G
E2
1
22X
b
0.10 C A B
NOTE 3
0.05 C
4.30
1.47
1.47 1.58
16X
K
18
e
BOTTOM VIEW
G2
D2
22X
0.52
22X
0.30
0.39
1.14
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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NUS6160MN/D
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